LIGA technology uses X-ray lithography to obtain polymer structures with vertical and extremely smooth sidewalls of, you name it, 10 to 2000µm thickness. These lithographic templates are then filled by electroplating to obtain micro- to millimeter-sized metal parts of the highest precision and typically of large height to width ratios. Properties of the electroplated material can be customized with respect to hardness, magnetic properties, wear resistance, etc. Inverse metal structures can be used as cavities for hot embossing or injection molding.
In addition to all aspects of X-ray lithography, our core competence is to electroplate gold and its alloy Au-Cd in very large heights up to 400µm. This allows to make the best pin-holes for X-rays for a vast range of energies.